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Advanced Ultrasonic Cleaning Machine


U6000 is specially designed to remove solder paste and flux that are utilized in the leadframe clip bonding (DFN, SOP/T) products. The cleaning procedure is aimed at ensuring that there are no volatile residues, hidden cracks, or any other quality issues present on the surfaces of both the product’s frame and chip. Moreover, the cleaning process will not have any adverse effects on the wire bonding of the product or its adhesion with the encapsulation material.


Machine Size:L4712 x W1800 x H2263 mm
Machine Weight:3000KG
Cleaning MediumCleaning Chemical + DI water