Leadframe

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  • FCCSP

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    FCCSP is Fully Auto Inline Cleaning Machine, suitable to use on high productivity IC, BGA, MEMS package carrier flux cleaning by using non contact transfer system to ensure protection on bumping, solder ceramic product. It contain multiples option to fulfill difference customer process optimization with lower ownership.
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  • S680

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    S680 come with  the most advanced cleaning technologies in an energy-efficient design. Machine with fully stainless steel body and piping be ready to fulfill Semicon cleanroom requirement.It has the ultimate in process flexibility and performance. Machine come with real time process control suc as flows, pressures, and temperatures are easily displayed on the touch panel interface. Compliance to SEC/GEM With its combination of spraying nozzle distribution with omni-directional spray patterns, It will achieve best result on greatly improves cleaning under low-standoff components and eliminates board and component shadowing effects.
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  • Xpower100

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    X Power Centrifugal Cleaning System provides high-performance, complete cleaning of electronic circuit assemblies, precision parts, medical devices, wafers, and advanced packages including copper piller, flip chips, MCMs, SIPs, BGAs, CSPs, and hybrid electronics. Centrifugal energy, produced when parts are rotated inside a sealed process chamber, provides thorough penetration, solubilisation, and contaminant removal when couple with appropriate cleaning chemistries.
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